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Semiconductor Wafer Surface Inspection

Visual & AI Inspection

Problem

The existing system, which relied on traditional rule-based image processing techniques, faced significant challenges in accurately classifying over 30 types of defects. Despite efforts to optimize the process, it resulted in a high misrecognition rate of 36%.

Our Solution

By deploying our advanced AI algorithms, we successfully addressed the challenges of identifying a wide variety of defects with high accuracy.

The misrecognition rate was drastically reduced from 36% to less than 1%, highlighting the remarkable effectiveness of our solution.

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